手机测试_Mini Loop测试流程

TITLE:

MD ALT2005 Mini-Loop and ALT2005 DtF TEST PROCEDURE

REVISION DATE: 04-12-06

MEMO: 333288 ISSUE: C Page 1 of 40

REVISION PAGE

ISSUE: MEMO: ORIGINATOR: DETAILS SPEC CHANGES: DATE: Issue O Issue A Issue B MEMO: 273281 07-07-05 MEMO: 275390 07/19/05 MEMO: 319093 01/06/06 John Harrop (847) 523-6531 Nayna Patel (847) 523-3981 Brian Cooper (847) 523-7407 Brian Cooper (847) 523-7407 Brian Cooper (847) 523-7407 Corrected BT Channels Appendix N, Initial Document Release Made changes to Mechanical Test Corrected Temperature Profile table Process- Signal Test to add back in post dry out cycle

intervals 17-18 appendix G.,

Corrected Temperature Profile graph appendix H.

Issue C MEMO: 333288 04/12/06 Brian Cooper (847) 523-7407

Added call process to B1 during ESD, Modified Appendix E to clarify failure mode occurrence.

CAUTION: THIS DOCUMENT CANNOT BE DISTRIBUTED OUTSIDE OF MOTOROLA.

NOTE: NO PART OF THIS SPECIFICATION MAY BE CHANGED WITHOUT AUTHORIZATION FROM THE MD

ALT CHANGE CONTROL BOARD (CCB)

NOTE: THIS SPECIFICATION SUPERSEDES THE REQUIREMENTS IN THE PRODUCT SPECIFICATION IF

THERE IS A CONFLICT IN REGARDS TO A SIMILAR TEST.

你可能喜欢

  • 硬件测试流程
  • MTK手机平台
  • 高加速寿命试验
  • 手机软件测试用例
  • 手机硬件知识
  • 手机生产流程
  • 手机设计流程
  • 手机开发流程

手机测试_Mini Loop测试流程相关文档

最新文档

返回顶部